BM1366 ASIC Chip
Bitmain BM1366 mining ASIC chip specifications, pinout, and repair reference. Used in the Antminer S19 XP (140 TH/s).
Overview
The BM1366 is a SHA-256 mining ASIC manufactured by Bitmain, used primarily in the Antminer S19 XP series. It represents a significant efficiency improvement over the BM1398 used in the original S19 line.
Specifications
| Parameter | Value |
|---|---|
| Manufacturer | Bitmain |
| Algorithm | SHA-256 |
| Process Node | 5nm |
| Package | BGA |
| Core Voltage (VDD) | 0.28V typical |
| I/O Voltage (VDDIO) | 1.8V |
| Operating Temp | -10°C to 85°C |
| Used In | Antminer S19 XP, S19 XP Hyd |
Pin Configuration
The BM1366 uses a BGA (Ball Grid Array) package. Key signal groups:
Power Pins
- VDD — Core power supply (0.28V nominal)
- VDDIO — I/O power supply (1.8V)
- VSS — Ground
Communication Pins
- CI — Clock Input (from previous chip or controller)
- CO — Clock Output (to next chip)
- RI — Receive Input (data from previous chip)
- RO — Receive Output (data to next chip)
- BO — Break Out signal (fault indication)
PLL Pins
- XCLK — External clock reference input
// PLL frequency register configuration for BM1366
// Target: 500 MHz core clock
#define BM1366_PLL_FREQ_500M 0x00F0286401
#define BM1366_PLL_FREQ_600M 0x00F0306401
#define BM1366_PLL_FREQ_700M 0x00F0386401Common Failure Modes
The BM1366 is sensitive to voltage spikes. Always check the upstream buck converter before replacing a failed chip.
1. Dead Chip (No Response)
- Chip does not respond to enumeration
- Often caused by electrical overstress or manufacturing defect
- Diagnose by testing BO signal and checking voltage at chip VDD pads
2. Low Performance
- Chip responds but produces fewer hashes than expected
- May indicate partial core failure
- Check PLL lock status and core voltage stability
3. Thermal Failure
- Chip overheats and triggers thermal shutdown
- Check thermal paste application and heatsink contact
- See Cooling & Thermal Management
Replacement Procedure
Replacing a BM1366 requires BGA rework equipment:
Preparation
Apply flux around the chip. Preheat the board to 150°C bottom-side.
Removal
Heat the chip from the top with hot air at 230°C until solder reflows. Lift the chip with vacuum pickup.
Pad Cleaning
Clean the pads with solder wick and flux. Inspect under magnification for bridge shorts.
Reballing & Placement
Reball the new BM1366 chip (or use pre-balled replacement). Align and place on the cleaned pads.
Reflow
Reflow at 230°C with controlled hot air profile. Allow the board to cool gradually.
For detailed BGA rework techniques, see the BGA Rework Guide.
Found In These Miners
- Antminer S19 XP — 140 TH/s, 134 chips per board
- Antminer S19 XP Hydro — liquid-cooled variant
Compare With
- BM1368 — Next generation, used in S21
- BM1398 — Previous generation, used in S19/S19 Pro
- BM1362 — Used in S19j Pro