AZIC Education

BM1366 ASIC Chip

Bitmain BM1366 mining ASIC chip specifications, pinout, and repair reference. Used in the Antminer S19 XP (140 TH/s).

Overview

The BM1366 is a SHA-256 mining ASIC manufactured by Bitmain, used primarily in the Antminer S19 XP series. It represents a significant efficiency improvement over the BM1398 used in the original S19 line.

Specifications

ParameterValue
ManufacturerBitmain
AlgorithmSHA-256
Process Node5nm
PackageBGA
Core Voltage (VDD)0.28V typical
I/O Voltage (VDDIO)1.8V
Operating Temp-10°C to 85°C
Used InAntminer S19 XP, S19 XP Hyd

Pin Configuration

The BM1366 uses a BGA (Ball Grid Array) package. Key signal groups:

Power Pins

  • VDD — Core power supply (0.28V nominal)
  • VDDIO — I/O power supply (1.8V)
  • VSS — Ground

Communication Pins

  • CI — Clock Input (from previous chip or controller)
  • CO — Clock Output (to next chip)
  • RI — Receive Input (data from previous chip)
  • RO — Receive Output (data to next chip)
  • BO — Break Out signal (fault indication)

PLL Pins

  • XCLK — External clock reference input
// PLL frequency register configuration for BM1366
// Target: 500 MHz core clock
#define BM1366_PLL_FREQ_500M  0x00F0286401
#define BM1366_PLL_FREQ_600M  0x00F0306401
#define BM1366_PLL_FREQ_700M  0x00F0386401

Common Failure Modes

The BM1366 is sensitive to voltage spikes. Always check the upstream buck converter before replacing a failed chip.

1. Dead Chip (No Response)

  • Chip does not respond to enumeration
  • Often caused by electrical overstress or manufacturing defect
  • Diagnose by testing BO signal and checking voltage at chip VDD pads

2. Low Performance

  • Chip responds but produces fewer hashes than expected
  • May indicate partial core failure
  • Check PLL lock status and core voltage stability

3. Thermal Failure

Replacement Procedure

Replacing a BM1366 requires BGA rework equipment:

Preparation

Apply flux around the chip. Preheat the board to 150°C bottom-side.

Removal

Heat the chip from the top with hot air at 230°C until solder reflows. Lift the chip with vacuum pickup.

Pad Cleaning

Clean the pads with solder wick and flux. Inspect under magnification for bridge shorts.

Reballing & Placement

Reball the new BM1366 chip (or use pre-balled replacement). Align and place on the cleaned pads.

Reflow

Reflow at 230°C with controlled hot air profile. Allow the board to cool gradually.

For detailed BGA rework techniques, see the BGA Rework Guide.

Found In These Miners

Compare With

  • BM1368 — Next generation, used in S21
  • BM1398 — Previous generation, used in S19/S19 Pro
  • BM1362 — Used in S19j Pro

Further Reading